Compact (70mm x 70mm) high-performance, low power COM module
The H6075 is a compact (70mm x 70mm) high-performance, low power COM module based on the Intel® Atom™ Apollo Lake System-on-Chip, SOC. The SOCs have the 9th generation Intel® HD Graphics Engine GPU built in along with a dual or quad core CPU and I/O controller.
The Qseven form factor makes H6075 a legacy free module with a full range of contemporary low voltage differential serial interfaces such as PCI Express, USB 3.0, SATA 3.0 and display interfaces such as DisplayPort or HDMI and Dual 24-bit LVDS.
Qseven modules are defined for low cost and ruggedness, with an MXM type edgecard connector interfacing the carrier board. H6075 has soldered memory and optional on-board eMMC Flash.
The H6075 is available in both standard and industrial grade operating temperature.
Specification
- Dual or Quad Core Intel Atom
- Soldered DDR3L RAM memory
- 9th Gen Intel HD Graphics
- Industrial temp. (optional)
Industrial temperature range
-40°C to 85°C
Intel® Internet of Things Solutions Alliance
Hectronic is an Affiliate member of the Intel® Internet of Things Solutions Alliance, a global ecosystem of 250+ member companies that provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics.